M1m Microelectronic AOI

Facts & Figures

  • Maximum Inspection area: 350mm x 250mm x 25mm XYZ
  • Lighting: Proprietary Fusion Lighting™ multiangle LED
  • Optics: Proprietary high resolution, low distortion with coaxial illumination
  • Imager: 3 megapixel color camera (3 to 9 micron pixel size).

Overview

The M1m offers high-speed microelectronic device inspection with exceptional defect coverage. With 5 micron pixel resolution and telecentric optics, the M1m provides complete inspection, all within a footprint less than 1 sq. meter.

  • Automated Optical Inspection for Microelectronics

    • Megapixel color imaging
    • High magnification top-down viewing camera
    • Quick set-up
    • High speed
    • High defect coverage
    • Low false failure rate
  • Nordson YESTECH’s advanced megapixel technology offers high-speed PCB inspection with exceptional defect coverage. With high resolution and telecentric optics, M1 Series inspects solder joints and verifies correct part assembly, all within a footprint less than 1 meter wide, enabling users to improve quality and increase throughput.

    Programming the M1 Series is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The M1 Series utilizes a standard package library to simplify training and insure program portability across manufacturing lines.

    Newly available image processing technology integrates several techniques, including color, normalized correlation and rule-based algorithms, to provide complete inspection coverage with an extremely low false failure rate.

    Configurable for all line positions, the M1 Series is equally effective for paste, pre / post-reflow or final assembly inspection. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.

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