XS Series

Overview

The XS-platform series is a small-footprint high-resolution automated X-ray inspection system concept designed for sophisticated high-speed inspection of semiconductor samples, wire bonds and PCB-assembly boards for single/multipanels or samples in trays. The inspectable applicaitons range from component level inspection to mid-sized SMT boards.

Matrix XS Series

High Resolution Automated X-ray Inspection

Characteristics

    • Flexible AXI system with minimum footprint for inline setups
    • Microfocus / submicron X-ray tube (seal tube / maintenance free)
    • Resolution down to <1µm
    • Multiple programmable motion system with servo drives
    • Digital CMOS flatpanel detector
    • Automatic grey-scale and geometrical calibration
    • Full product traceability via customized MES-Interface

Standard Configurations

    • SMT Setup for component and solder-joint inspeciton on PCB, hybrid or chip level assembly processes
    • Semi-Backend Setup for semiconductor applications, wire bond test (pre & post), light & complex PCB's and flex circuits

Technologies

    • Transmission X-ray imaging (2D) with patented Slice-Filter-Technique™
    • Off-axis technology (2.5D)
    • 3D SART (Simultaneous Algebraic Reconstruction Technique)

Models

Depending on the type of product and inspection task

    • XS-2Transmission (2D) + SFT™
    • XS-2.5Transmission (2D) + SFT™ + Off-axis (2.5D)
    • XS-3Transmission (2D) + SFT™ + Off-axis (2.5D) + 3D SART

Additional Options

    • Same-side load/unload configuration
    • Barcode scanner for serial number and product type selection
    • Auto BCR scanning station (x-y gantry)
    • Low dose radiation filter

Overlapping wires in 2D

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Wire tracing

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Voiding under bond ball

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