YESTech's advanced Thin Camera™ technology offers off-line benchtop PCB inspection with exceptional defect coverage. This benchtop system inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.

Programming the B3 is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The B3 utilizes a standard package library to simplify training and insure program portability across manufacturing lines. Programs created with the B3 are also compatible with YESTech's complete line of AOI systems.

Newly available Fusion Lighting™ and advanced image processing technology integrates several techniques, including color, normalized correlation and rule-base algorithms, to provide complete inspection coverage with an extremely low false failure rate.

The B3 is equally effective for pre / post-reflow or even final assembly inspection. Remote programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.