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YESTech's advanced Thin Camera technology offers high-speed PCB inspection
with exceptional defect coverage. With up to four top - down viewing cameras and four side viewing cameras, the YTV inspects
solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.
Programming
the YTV is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including
solder inspection. The YTV utilizes a standard package library to simplify training and insure program portability across
manufacturing lines.
Newly available image processing technology integrates several techniques, including color, template
matching and rule-based algorithms, to provide complete inspection coverage with an extremely low false failure rate.
Configurable for all line positions, the YTV is equally effective for paste, pre / post-reflow or final assembly
inspection. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement
solution.
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