• Quick Set-up

• High Defect Coverage

• High Speed

• Low False Failure Rate

• Smaller Footprint

• Best Price Performance

YESTech Europe

M1

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M1 In-Line Automated Optical Inspection
 
3Mpixel Single Camera, Fusion lighting
 
and Telecentric lens

YESTech’s advanced Thin Camera™ technology offers high-speed PCB inspection with exceptional defect coverage. With three megapixel resolution and telecentric optics, M1 Series inspects solder joints and verifies correct part assembly, all within a footprint less than 1 meter wide, enabling users to improve quality and increase throughput.

Programming the M1 Series is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The M1 Series utilizes a standard package library to simplify training and insure program portability across manufacturing lines.

Newly available image processing technology integrates several techniques, including color, normalized correlation and rule-based algorithms, to provide complete inspection coverage with an extremely low false failure rate.

Configurable for all line positions, the M1 Series is equally effective for paste, pre / post-reflow or final assembly inspection. Off-line programming maximizes machine utilization and real-timeSPC monitoring provides a valuable yield enhancement solution.

YTV M1
YTV M1 Specialised Inspection

Download the M1 datasheet (pdf)

YESTech Europe, Charwell House, Alton, Hampshire, GU34 2PP