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YESTech’s advanced Thin Camera ™
technology offers high-speed PCB inspection with exceptional defect
coverage. With three megapixel resolution and telecentric optics, M1 Series inspects
solder joints and verifies correct part assembly, all within a footprint less
than 1 meter wide, enabling users to improve quality and increase throughput.
Programming the M1 Series is fast and intuitive. Operators typically take
less than 30 minutes to create a complete inspection program including solder
inspection. The M1 Series utilizes a standard package library to simplify training
and insure program portability across manufacturing lines.
Newly available image processing technology integrates several techniques,
including color, normalized correlation and rule-based algorithms, to provide
complete inspection coverage with an extremely low false failure
rate.
Configurable for all line positions, the M1 Series is equally effective for paste, pre / post-reflow or final assembly inspection. Off-line
programming maximizes machine utilization and real-timeSPC monitoring provides
a valuable yield enhancement solution.
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