Products

FX In Line Paste Inspection

Using the features of the Nordson YESTECH in-line AOI systems the SPI system is configured to inspect paste presence / absence, insufficient paste coverage and smearing. Because the system is base on the standard AOI programming is fast and easy and the outputs can be used directly for line tuning.

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With its super fast capture on the fly image acquisition the FXSL can inspect paste in 2D at up to three times the speed of the standard FX. All of the techniques from the standard FX are utilised to provide presence and absence tests, sufficient coverage and smearing.

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Nordson YESTECH's M series of SP Iand AOI systems provide resolutions down to 3 microns as required for detailed inspection on smaller circuit boards. With angled and coaxial lighting and telecentric lenses the M1 is unsurpassed in inspection quality and can draw on all of the standard algorithms available on the larger F series systems.

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The FX in-line AOI system is the work horse of the Nordson YESTECH range. Providing a wide range of tools configured in hardware (lighting, cameras etc) and software (algorithms, vector and image analysis) the FX programmes from libraries and CAD data to quikley generate inspection programmes with optimum throughput. The standard FX can inspect down to 8 micron resolution with top and side angled cameras. RGB, coaxial and white lighting are standard to give enhanced part and solder inspection.

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High Speed is essential on today's production lines and the FXSL is designed to keep pace with the fastest. Using a capture on the fly image acquisition technique the FXSL deploys its range of algorithm and image based fault detection routines to quickly detect part and solder faults with a minimum of false calls. Programming is fast and repeatable being library and algorithm based.

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Using telecentric lenses with up to 3 micron resolution the M1AOI system from the Nordson YESTECH AOI range can detect faults on the smallest of components.

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Using an image set collected from an in-line or benchtop system a complete recipe can be created. The off line station uses the same software as used on the systems so there is no additional training required. Using a standard network the programming station can connect directly to any number of systems.

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the Nordson-YESTECH rework station delivers the same images of the failing parts to the operator as would be seen on the inspection system. Failing parts are quickly classified and added to the SPC database. Boards can be displayed automatically to the last board inspected or using the serial number of the board or panel.

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With the increased use of power devices requiring thermal control and the placement of components such as BGA, POP and QFN there is a greater need for X-Ray inspection at production line speeds. The X2 provides full automated analysis of circuit boards in 2D and can automatically detect for voids, bridges and sufficient solder using the standard, easy to use, Yestech user interface.

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With the increased use of power devices requiring thermal control and the placement of components such as BGA, POP and QFN there is a greater need for X-Ray inspection at production line speeds. The X3 provides both 2D and 3D (tomosynthesis) analysis of components and can detect defects on double sided assemblies or POP at line speeds.

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Visit the Nordson DAGE web site for the world leaders in X-Ray for electronics. Nordson DAGE

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Today's electronics are being used in ever more hazardous environments and many are being given protective coatings. the ACI in line or benchtop AOI can detect the UV fluorescent marker in the coating and check for coverage, drips, holes and many other defects.

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Today's electronics are being used in ever more hazardous environments and many are being given protective coatings. the ACI in line or benchtop AOI can detect the UV fluorescent marker in the coating and check for coverage, drips, holes and many other defects.

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Microelectronics built directly into circuits and hybrid construction are becoming a larger part of electronics manufacture. The M1m has resolution down to 3 microns with angled and coaxial lighting to be able to detect bonds, wires, contamination and many other possible faults.

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The BX series benchtop AOI has all of the features of the in-line FX series but in a compact package. The programmer can utilise the angled and coaxial RGB lighting, angled cameras and laser height detection in exactly the same way as the larger models. Programmes directly transfer between in-line and benchtop systems.

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All of the Nordson YESTECH AOI and X-Ray systems connect directly to the SPC data collection systems via a standard network. SPC outputs can be through Microsoft Access, SQL, text file or third party factory information systems (FIS).

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